SUPPLY METHOD OF SOLDER

PURPOSE:To eliminate the need for the formation of a flat surface in spare solder as seen in conventional devices by forming a recessed section to the spare solder and ensuring positioning at the time of the soldering of the terminal piece of a package. CONSTITUTION:When a mask 3 with a through-hole 4 formed of a material generating no solder moistening is superposed on a substrate 1 with a pad 2, ball solder is inserted into the through-hole by conforming the pad and the through-hole while a member 7, provided with a pin 6 shaped of a material generating no solder moistening so as to be projected to approximately the center of the through-hole, is held to the upper section of the mask, and spare solder is shaped to the pad by the melting of ball solder by heating, the member 7 is lowered onto the top face of the mask by the melting of ball solder, and a recessed section 8 by the pin 6 is formed at the central section of the spare solder. Positioning is performed by inserting a terminal piece into the recessed section 8, and the spare solder 9 is melted by heating, thus easily joining the terminal piece with the pad 2.