PARTIAL PLATING EQUIPMENT

PURPOSE:To make the outflow velocity of plating liquid discharged from a plating jig small and to reduce entrainment of air into the plating liquid by providing a net made of resin to the discharge hole of the plating liquid of the plating jig in an equipment for performing metallic plating only on...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KAWABE TAKAHIRO, YASHIKI TAKANOBU
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To make the outflow velocity of plating liquid discharged from a plating jig small and to reduce entrainment of air into the plating liquid by providing a net made of resin to the discharge hole of the plating liquid of the plating jig in an equipment for performing metallic plating only on the necessary part of an IC lead frame, etc. CONSTITUTION:A plurality of band-like lead frames 9 are fitted to a plating jig 3 and plating liquid in a main tank 7 is injected through an ejector 1a by a pump 2. Metallic plating is performed by utilizing the lead frames 9 as a cathode and allowing current to flow. After the lead frames 9 are plated, plating liquid is passed through a net 4 made of resin provided to the outflow port of the plating jig 3 and introduced into a liquid receiving tank 1 along a liquid receiving plate 5. Since the plating liquid is slowly introduced into the main tank 7 along a plating liquid circulating path 6 having a constant angle, entrainment of air due to violent flow is made little and such amount that the plating liquid is overflowed from the main tank 7 by foaming due to entrainment of air thereinto and lost is reduced.