SEMICONDUCTOR DEVICE

PURPOSE:To increase a mounting area and to increase mounting strength by forming outer leads with a main bodies and additional parts, and mounting the leads on a ceramics package. CONSTITUTION:When each outer lead is molded, it is molded so that both sides of the inner end of the main body of the le...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	OGATA TOSHIICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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