SEMICONDUCTOR DEVICE

PURPOSE:To increase a mounting area and to increase mounting strength by forming outer leads with a main bodies and additional parts, and mounting the leads on a ceramics package. CONSTITUTION:When each outer lead is molded, it is molded so that both sides of the inner end of the main body of the lead are expanded outward. Then, both expanded sides are bent at right angles with the width part of the main body of the lead made to remain. The outer leads are constituted of the lead main bodies 6A and 7A and additional parts 6B and 7B. The height of the additional part is made to be the same height as the upper surface of a second ceramics frame 4. Mounting patterns and input/output matching patterns are metallized on the upper surface of a ceramics frame 3 at outer-lead mounting parts 5A and 5B. The patterns are metallized on both side walls of the outer-lead mounting parts 5A and 5B. The lead main bodies 6A and 7A are mounted on the first frame 3, and the additional parts 6B and 7B are mounted on both side walls. Since the mounting area is increased, the mounting strength is increased.