SEMICONDUCTOR DEVICE

PURPOSE:To increase a mounting area and to increase mounting strength by forming outer leads with a main bodies and additional parts, and mounting the leads on a ceramics package. CONSTITUTION:When each outer lead is molded, it is molded so that both sides of the inner end of the main body of the le...

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1. Verfasser:	OGATA TOSHIICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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creator	OGATA TOSHIICHI
description	PURPOSE:To increase a mounting area and to increase mounting strength by forming outer leads with a main bodies and additional parts, and mounting the leads on a ceramics package. CONSTITUTION:When each outer lead is molded, it is molded so that both sides of the inner end of the main body of the lead are expanded outward. Then, both expanded sides are bent at right angles with the width part of the main body of the lead made to remain. The outer leads are constituted of the lead main bodies 6A and 7A and additional parts 6B and 7B. The height of the additional part is made to be the same height as the upper surface of a second ceramics frame 4. Mounting patterns and input/output matching patterns are metallized on the upper surface of a ceramics frame 3 at outer-lead mounting parts 5A and 5B. The patterns are metallized on both side walls of the outer-lead mounting parts 5A and 5B. The lead main bodies 6A and 7A are mounted on the first frame 3, and the additional parts 6B and 7B are mounted on both side walls. Since the mounting area is increased, the mounting strength is increased.
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CONSTITUTION:When each outer lead is molded, it is molded so that both sides of the inner end of the main body of the lead are expanded outward. Then, both expanded sides are bent at right angles with the width part of the main body of the lead made to remain. The outer leads are constituted of the lead main bodies 6A and 7A and additional parts 6B and 7B. The height of the additional part is made to be the same height as the upper surface of a second ceramics frame 4. Mounting patterns and input/output matching patterns are metallized on the upper surface of a ceramics frame 3 at outer-lead mounting parts 5A and 5B. The patterns are metallized on both side walls of the outer-lead mounting parts 5A and 5B. The lead main bodies 6A and 7A are mounted on the first frame 3, and the additional parts 6B and 7B are mounted on both side walls. 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CONSTITUTION:When each outer lead is molded, it is molded so that both sides of the inner end of the main body of the lead are expanded outward. Then, both expanded sides are bent at right angles with the width part of the main body of the lead made to remain. The outer leads are constituted of the lead main bodies 6A and 7A and additional parts 6B and 7B. The height of the additional part is made to be the same height as the upper surface of a second ceramics frame 4. Mounting patterns and input/output matching patterns are metallized on the upper surface of a ceramics frame 3 at outer-lead mounting parts 5A and 5B. The patterns are metallized on both side walls of the outer-lead mounting parts 5A and 5B. The lead main bodies 6A and 7A are mounted on the first frame 3, and the additional parts 6B and 7B are mounted on both side walls. Since the mounting area is increased, the mounting strength is increased.</abstract><oa>free_for_read</oa></addata></record>
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subjects	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
title	SEMICONDUCTOR DEVICE
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