EPOXY RESIN POWDER COATING MATERIAL SUITABLE FOR SLOT INSULATION

PURPOSE:To obtain the title material excellent in an edge coverage, heat resistance, adhesiveness, impact resistance, etc., by mixing a specified epoxy resin with a carboxyl-terminated polyester resin, a curing agent and a filler. CONSTITUTION:100 pts.wt. epoxy resin based on a bisphenol A epoxy res...

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1. Verfasser: MATSUZAKI KUNIMITSU
Format: Patent
Sprache:eng
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Zusammenfassung:PURPOSE:To obtain the title material excellent in an edge coverage, heat resistance, adhesiveness, impact resistance, etc., by mixing a specified epoxy resin with a carboxyl-terminated polyester resin, a curing agent and a filler. CONSTITUTION:100 pts.wt. epoxy resin based on a bisphenol A epoxy resin of an average MW of 1700-4500, prepared by mixing a bisphenol A epoxy resin of an average MW of 2500-8000 and an m.p. of, desirably, 120-160 deg.C with a bisphenol A epoxy resin of an average MW of 300-1700 and an m.p. of, desirably, >=75 deg.C with 5-100 pts.wt. carboxyl-terminated polyester resin, desirably, of a softening point >=70 deg.C, an acid value of 30-150 (KOH mg/g), an average MW of 600-2500 and a mean particle diameter of about 500-100mum, a curing agent (e.g., imidazole type) and a filler (e.g., CaCO3).