FILM CAPACITOR AND MANUFACTURE THEREOF
PURPOSE:To obtain a film capacitor with improved contact reliability by enhansing the connection strength of a lead wire for leading out an electrode and stabilizing the connection part by providing a solder layer at a protruding part of the electrode of the edge surface of a capacitor element main...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | PURPOSE:To obtain a film capacitor with improved contact reliability by enhansing the connection strength of a lead wire for leading out an electrode and stabilizing the connection part by providing a solder layer at a protruding part of the electrode of the edge surface of a capacitor element main body and connecting a lead wire to the solder layer. CONSTITUTION:A solder layer 3 is provided at a protruding part 2 of the electrode of edge surface of the capacitor element main body 1 which consists of a dielectric film and an electrode foil and a lead wire 4 is connected to the soldering layer. Namely, the connection strength of the capacitor element main body and the lead wire is improved as compared with that of the single connection method since the lead wire is connected to the solder layer and the deviation is also small. Thus, the connection state between the capacitor element main body and the lead wire becomes stable and reliable and a film capacitor fully utilizing high-frequency characteristics owned by the capacitor element main body itself can be obtained. |
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