ELECTRONIC COMPONENT PACKAGING METHOD

PURPOSE:To enable a wiring pattern and a conductor to be fixed to each other by a method wherein an electronic component is made to be in such a state that it is kept bearing on a wiring pattern as being housed in a housing hole formed on a substrate, and the conductor, which makes the terminal of the component connected with the wiring pattern that is provided to a substrate, is provided to the terminal concerned. CONSTITUTION:At the packaging of a flat type crystal vibrator 15 on a substrate 3, a rectangular conductor 13 is previously provided to a terminal 17 of the flat type crystal oscillator 15 in such a state that it bears on a wiring pattern 9 of the substrate 3 under a condition that the vibrator 15 is housed in a housing hole 5 of the substrate 3, and a bearing section between the conductor 13 and the wiring pattern 9 is fixed with a solder 11 at packaging. The conductor 13 is, for instance, composed of a copper foil and formed into a rectangular shape so as to bear on the wiring pattern of the substrate 3 in a state that the oscillator 15 is housed in the housing hole 5 of the substrate 3, which is previously fixed to the terminal 17 of the flat type crystal vibrator 15 before packaging.