SEMICONDUCTOR DEVICE

PURPOSE:To lower the level of wire loops and to reduce the size of a power module, by inclining the side faces of a heat sink block such that the width of the heat sink block gradually becomes larger from the top face to the bottom face. CONSTITUTION:Side faces of a heat sink block 5 on which a semiconductor chip 6 is not mounted are inclined to define inclined faces 11, such that the width of the heat sink block 5 gradually becomes larger from the semiconductor chip mounting face 5a towards the bottom face 5b. These inclined faces 11 are inclined by an angle that insures conduction of heat generated in the peripheral part of the semiconductor chip 6. Since wires 7, 8 to be bonded are hardly brought into contact with the heat sink block 4 according to such construction, the level of loops of the wires 7, 8 need not be high, and electrodes to which the wires 7, 8 are to be bonded can be formed close to the heat sink block 5 on the substrate 1. Thus, a small-sized power module can be obtained.