SOLDERING METHOD FOR DOUBLE-SIDED MOUNTING PRINTED WIRING BOARD

PURPOSE:To perform soldering without deviation of reflow construction method mounting face parts from the first position thereof by injecting adhesive into its injecting hole before it is passed through a solder dip construction method soldering device and fixing the reflow construction method mounting face parts. CONSTITUTION:A semifinished printed wiring board 1 is mounted on a printed wiring board supply device 11, supplied in an adhesive applying device 17 and the adhesive 3 is applied on the mounting parts of dip construction method mounting face parts 5. The adhesive 3 is injected into an injecting hole 2 and the substrate 1 and the reflow construction method mounting face parts 4 are bonded. Next the dip construction method mounting face parts 5 is mounted in an electronic parts mounting device 13. Further the parts 5 are sent to a printed wiring board reversing device 15, the inside and outside of the substrate 1 are reversed and the parts 5 are soldered by a dip soldering device 19. Further since the adhesive 3 is injected into the injecting hole 2 and the substrate 1 and the reflow construction method mounting face parts 4 are bonded, the parts 4 are not moved from a firstly mounted position and soldering is completed.