MANUFACTURE OF PRINTED WIRING BOARD

PURPOSE:To obtain a manufacturing method of a printed-wiring board which maintains the high peeling strength and whose operation efficiency is excellent by introducing a hydrophilic treatment process between a plating resist formation process and an electroless plating process. CONSTITUTION:A through hole is made in an insulating board whose surface has been coated with an adhesive containing an electroless plating catalyst and which does not contain the electroless plating catalyst; after that, the surface of the adhesive is roughened by using a chemical roughening liquid, and is activated by using an electroless catalyst solution; a fragile layer, on the surface of the adhesive, which has been caused by a roughening operation is removed. Then, a plating resist is formed in a part other than a circuit formation part; a hydrophilic treatment is executed in such a way that an amount of a polar radical on the surface of the adhesive is 1X10mol/cm when it is measured by means of an adsorption method of methylene blue as a basic dye; after that, a circuit is formed in a part other than a resist formation part by using an electroless plating method. For example, for said hydrophilic treatment this assembly is immersed in a 0.1M disodium hydrogen phosphate/sodium hydroxide aqueous solution with a pH of 12.3 at 70 deg.C for 30 minutes and is then washed by water.