FORMATION OF RESIST PATTERN FOR PLATING BUMP

PURPOSE:To prevent generation of resist residual and to prevent reduction in pattern adhesion strength by coating a positive type photoresist to a lower layer resist and then performing exposure, by coating a negative type dry film photoresist on the upper layer and then performing exposure, and the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YAHAGI SEIJI, OGAWA KENICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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