FORMATION OF MULTILAYERED THICK FILM CIRCUIT BOARD

FORMATION OF MULTILAYERED THICK FILM CIRCUIT BOARD

PURPOSE:To attain stable printing resolution of a circuit, by placing plane parts of a substrate surface, on which a projected multilayered thick film is formed, on projected parts formed on a jig holder for a printed circuit and forming a circuit on the back side of the multilayered thick film. CON...

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Hauptverfasser: YOKOYAMA YUTAKA, TAKEOKA TETSUO, KAWABATA KIYOSHI
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Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator YOKOYAMA YUTAKA
TAKEOKA TETSUO
KAWABATA KIYOSHI
description PURPOSE:To attain stable printing resolution of a circuit, by placing plane parts of a substrate surface, on which a projected multilayered thick film is formed, on projected parts formed on a jig holder for a printed circuit and forming a circuit on the back side of the multilayered thick film. CONSTITUTION:Projected parts 4 are formed on a jig holder 6 for a printed circuit, an alumina ceramic board 5 bearing a multilayered thick film composed of a conductive underlayer 1, a dielectric layer 2, and a conductive upperlayer 3 is placed on the jig with the conductive underlayer 1 being on the projected parts 4, and then a circuit is formed on the back side of the multilayered thick film to give a multilayered thick film circuit. By this formation method, the alumina ceramic board can keep its parallism during the process of printing a conductor circuit on the back side, consequently stable printing resolution is attained.
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CONSTITUTION:Projected parts 4 are formed on a jig holder 6 for a printed circuit, an alumina ceramic board 5 bearing a multilayered thick film composed of a conductive underlayer 1, a dielectric layer 2, and a conductive upperlayer 3 is placed on the jig with the conductive underlayer 1 being on the projected parts 4, and then a circuit is formed on the back side of the multilayered thick film to give a multilayered thick film circuit. 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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title FORMATION OF MULTILAYERED THICK FILM CIRCUIT BOARD
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