FORMATION OF MULTILAYERED THICK FILM CIRCUIT BOARD

PURPOSE:To attain stable printing resolution of a circuit, by placing plane parts of a substrate surface, on which a projected multilayered thick film is formed, on projected parts formed on a jig holder for a printed circuit and forming a circuit on the back side of the multilayered thick film. CONSTITUTION:Projected parts 4 are formed on a jig holder 6 for a printed circuit, an alumina ceramic board 5 bearing a multilayered thick film composed of a conductive underlayer 1, a dielectric layer 2, and a conductive upperlayer 3 is placed on the jig with the conductive underlayer 1 being on the projected parts 4, and then a circuit is formed on the back side of the multilayered thick film to give a multilayered thick film circuit. By this formation method, the alumina ceramic board can keep its parallism during the process of printing a conductor circuit on the back side, consequently stable printing resolution is attained.