FORMATION OF MULTILAYERED THICK FILM CIRCUIT BOARD

PURPOSE:To keep a circuit board in parallel and attain stable resolution of a printed circuit, by inserting a projected part composed of a multilayered thick film and formed on a substrate surface into a caved part formed in a jig holder for a printed circuit and forming a circuit on the back side of the multilayered thick film. CONSTITUTION:A recessed part 4 is formed in a jig holder 6 for a printed circuit and a projected part of a multilayered thick film comprised of a conductive underlayer 1, a dielectric layer 2, and a conductive upper layer 3 and formed on an alumina ceramic substrate 5 is inserted into the recessed part 4, and then a circuit is formed on the back side of the multilayered thick film to be a multilayered thick film circuit board. Conventionally, because the conductive underlayer 1, the dielectric layer 2, and the conductive upper layer 3 are formed in the center of an alumina ceramic board 5, a seesawing phenomenon is caused in printing process to form a conductive circuit, etc., on the back side and keeping the alumina ceramic substrate in parallel is difficult. Problems to cause resolution defects of the printed circuit in the printing process is thus resolved.