ION BEAM SPUTTERING DEVICE

PURPOSE:To easily control the composition of a thin film composed of plural components and formed on a substrate by moving a target part in which plural kinds of targets are mosaically arranged and making the area ratio among respective targets in an ionic irradiation region variable. CONSTITUTION:I...

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Hauptverfasser: KODERA KOICHI, INOUE ISAMU
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creator KODERA KOICHI
INOUE ISAMU
description PURPOSE:To easily control the composition of a thin film composed of plural components and formed on a substrate by moving a target part in which plural kinds of targets are mosaically arranged and making the area ratio among respective targets in an ionic irradiation region variable. CONSTITUTION:In a vacuum chamber 1, a target part 3 in which plural kinds of targets are mosaically arranged is irradiated by an ion beam 6 formed by ionizing an inert gas by means of an ion gun 2, by which the targets are sputtered and a thin film of plural components is formed on a substrate 4 held by a rotary plate 10. In the above ion beam sputtering device, the above target part 3 is moved by means of a target part position control circuit 11 via a target part position control mechanism section 8, by which the area ratio among respective targets in the ion beam irradiation region in the target part 3 can be regulated. By this method, the above thin film can be formed into the desired composition.
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CONSTITUTION:In a vacuum chamber 1, a target part 3 in which plural kinds of targets are mosaically arranged is irradiated by an ion beam 6 formed by ionizing an inert gas by means of an ion gun 2, by which the targets are sputtered and a thin film of plural components is formed on a substrate 4 held by a rotary plate 10. In the above ion beam sputtering device, the above target part 3 is moved by means of a target part position control circuit 11 via a target part position control mechanism section 8, by which the area ratio among respective targets in the ion beam irradiation region in the target part 3 can be regulated. 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CONSTITUTION:In a vacuum chamber 1, a target part 3 in which plural kinds of targets are mosaically arranged is irradiated by an ion beam 6 formed by ionizing an inert gas by means of an ion gun 2, by which the targets are sputtered and a thin film of plural components is formed on a substrate 4 held by a rotary plate 10. In the above ion beam sputtering device, the above target part 3 is moved by means of a target part position control circuit 11 via a target part position control mechanism section 8, by which the area ratio among respective targets in the ion beam irradiation region in the target part 3 can be regulated. By this method, the above thin film can be formed into the desired composition.</abstract><oa>free_for_read</oa></addata></record>
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subjects CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
title ION BEAM SPUTTERING DEVICE
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