ELECTRODE FITTING OF SUPERCONDUCTING CERAMIC

PURPOSE:To fit a firm electrode by inserting a copper wire into a solder fused pond provided on the surface of a superconducting ceramic and applying high-frequency vibration to the fused pond and the ceramic after the solder is hardened. CONSTITUTION:A solder 2 and the tip of a soldering iron 3 are...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: NIINO TOSHIFUMI, KIYOKAWA HIROSHI, ONE KIYOSHI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To fit a firm electrode by inserting a copper wire into a solder fused pond provided on the surface of a superconducting ceramic and applying high-frequency vibration to the fused pond and the ceramic after the solder is hardened. CONSTITUTION:A solder 2 and the tip of a soldering iron 3 are put to the necessary portion of the surface of a superconducting ceramic 1 to form a solder fused pond 4. A copper wire 5 is inserted into the fused pond 4, the tip of the soldering iron 3 is removed from the fused pond 4. When the temperature of the solder 2 is lowered and it is hardened, soldering is completed. There is a fear that the solder 2 is formed in a spherical shape by the surface tension or the adhesive force between the solder 2 and the ceramic 1 is insufficient under this condition. High-frequency vibration is applied to the fused pond 4 and the ceramic 1 by a high-frequency vibrator 6, thus a firm electrode is fitted on the ceramic 1.