LIGHT AND HEAT CURABLE COMPOSITION

PURPOSE:To improve the heat-resisting property against a solder of the title composition by incorporating a linear polymer compd. having an ethylenically unsatd. group and a carboxylic group in the side chain of the polymer, a photopolymerizable monomer having two or more of ethylenically unsatd. gr...

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Bibliographische Detailangaben
1. Verfasser: SHIRATO HITOSHI
Format: Patent
Sprache:eng
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