LIGHT AND HEAT CURABLE COMPOSITION

PURPOSE:To improve the heat-resisting property against a solder of the title composition by incorporating a linear polymer compd. having an ethylenically unsatd. group and a carboxylic group in the side chain of the polymer, a photopolymerizable monomer having two or more of ethylenically unsatd. gr...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	SHIRATO HITOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR AUXILIARY PROCESSES IN PHOTOGRAPHY CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR,STEREO-PHOTOGRAPHIC PROCESSES PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES PHYSICS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PURPOSE:To improve the heat-resisting property against a solder of the title composition by incorporating a linear polymer compd. having an ethylenically unsatd. group and a carboxylic group in the side chain of the polymer, a photopolymerizable monomer having two or more of ethylenically unsatd. groups in the end group of the monomer, an epoxy resin having two or more of epoxy groups in a molecule, a photosensitizer, a thermosetting agent and a specified low b.p. solvent in specified amounts of each components, respectively. CONSTITUTION:The linear polymer compd. having the ethylenically unsatd. group and the carboxylic group in the side chain of the polymer is incorporated in the composition in an amount of 10-90wt.%, and the photopolymerizable monomer having two or more of the ethylenically unsatd. groups in the end group of the monomer is incorporated in the composition in an amount of 5-90wt.%. The epoxy resin having at least two epoxy groups in the molecule is incorporated in the composition in an amount of 1-90wt.%, and the photosensitizer is incorporated in the composition in an amount of 0.01-15wt.%. One kind or two or more kinds of the thermosetting agent are incorporated in the composition in an amount of 0.01-15wt.%. And, the low b.p. solvent which has the low b.p. of