ELECTROPLATING DEVICE

PURPOSE:To surely form a plating film in a small hole by alternately actuating a plating DC power source and a means for vibrating a material to be plated, and effectively removing the bubbles generated in the small hole of the material. CONSTITUTION:A printed board 2 coated with a copper film is supported by a clip 7, and dipped in the soln. in a plating tank 1. The plating DC power source 13 and a motor 12 of the vibrator 5 are alternately actuated by a control unit 15. When the power source 13 is actuated, a current is applied in an electrolyte with an electrode 14 consisting of lead as the anode and the printed board 2 as a cathode to deposit a solder film on the copper film. In this process, bubbles are generated in the small hole 42 of the board 2, and the formation of solder film becomes impossible. The actuation of the DC power source 13 is stopped at this time. The motor 12 is driven to start the vibration of a diaphragm to remove the bubbles in the small hole 42, and the small hole 42 is filled with an electrolyte. The motor 12 is then stopped, and the DC power source 13 is again actuated.