CHIPLIKE ELECTRONIC COMPONENT FEEDING METHOD

CHIPLIKE ELECTRONIC COMPONENT FEEDING METHOD

PURPOSE:To enable a chiplike electronic component to be sucked in such a state that the component is held making its side face of the maximum area upright by a method wherein one side of the chip-like component is pushed up by a component push-up pin which protrudes into a pocket and a vacuum suctio...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: NAKAMURA MASABUMI
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator NAKAMURA MASABUMI
description PURPOSE:To enable a chiplike electronic component to be sucked in such a state that the component is held making its side face of the maximum area upright by a method wherein one side of the chip-like component is pushed up by a component push-up pin which protrudes into a pocket and a vacuum suction device is made to approach as the component is kept in this state. CONSTITUTION:When a component push-up pin 27 is made to ascend, the pin 27 protrudes into a pocket 11 breaking through a cover film 14 and lifts the front of a chiplike electronic component 1. When the pin 27 is made to ascend further, the side face maximum in area of the component 1 is made to stand upright gradually. A component suction device 26 is made to descend when the component 1 stands completely upright, and the component 1 is sucked by the device 25 in a preintended position. The device 25 is made to ascend and transfer the component 1, and the push-up pin 27 is made to descend and pulled out from the film 14. By these processes, the component 1 is sucked with its side face maximum in area upright.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPH01258499A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPH01258499A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPH01258499A3</originalsourceid><addsrcrecordid>eNrjZNBx9vAM8PH0dlVw9XF1Dgny9_N0VnD29w3w93P1C1Fwc3V18fRzV_B1DfHwd-FhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfFeAR4GhkamFiaWlo7GxKgBAKByJXg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>CHIPLIKE ELECTRONIC COMPONENT FEEDING METHOD</title><source>esp@cenet</source><creator>NAKAMURA MASABUMI</creator><creatorcontrib>NAKAMURA MASABUMI</creatorcontrib><description>PURPOSE:To enable a chiplike electronic component to be sucked in such a state that the component is held making its side face of the maximum area upright by a method wherein one side of the chip-like component is pushed up by a component push-up pin which protrudes into a pocket and a vacuum suction device is made to approach as the component is kept in this state. CONSTITUTION:When a component push-up pin 27 is made to ascend, the pin 27 protrudes into a pocket 11 breaking through a cover film 14 and lifts the front of a chiplike electronic component 1. When the pin 27 is made to ascend further, the side face maximum in area of the component 1 is made to stand upright gradually. A component suction device 26 is made to descend when the component 1 stands completely upright, and the component 1 is sucked by the device 25 in a preintended position. The device 25 is made to ascend and transfer the component 1, and the push-up pin 27 is made to descend and pulled out from the film 14. By these processes, the component 1 is sucked with its side face maximum in area upright.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>1989</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19891016&amp;DB=EPODOC&amp;CC=JP&amp;NR=H01258499A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19891016&amp;DB=EPODOC&amp;CC=JP&amp;NR=H01258499A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NAKAMURA MASABUMI</creatorcontrib><title>CHIPLIKE ELECTRONIC COMPONENT FEEDING METHOD</title><description>PURPOSE:To enable a chiplike electronic component to be sucked in such a state that the component is held making its side face of the maximum area upright by a method wherein one side of the chip-like component is pushed up by a component push-up pin which protrudes into a pocket and a vacuum suction device is made to approach as the component is kept in this state. CONSTITUTION:When a component push-up pin 27 is made to ascend, the pin 27 protrudes into a pocket 11 breaking through a cover film 14 and lifts the front of a chiplike electronic component 1. When the pin 27 is made to ascend further, the side face maximum in area of the component 1 is made to stand upright gradually. A component suction device 26 is made to descend when the component 1 stands completely upright, and the component 1 is sucked by the device 25 in a preintended position. The device 25 is made to ascend and transfer the component 1, and the push-up pin 27 is made to descend and pulled out from the film 14. By these processes, the component 1 is sucked with its side face maximum in area upright.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1989</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNBx9vAM8PH0dlVw9XF1Dgny9_N0VnD29w3w93P1C1Fwc3V18fRzV_B1DfHwd-FhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfFeAR4GhkamFiaWlo7GxKgBAKByJXg</recordid><startdate>19891016</startdate><enddate>19891016</enddate><creator>NAKAMURA MASABUMI</creator><scope>EVB</scope></search><sort><creationdate>19891016</creationdate><title>CHIPLIKE ELECTRONIC COMPONENT FEEDING METHOD</title><author>NAKAMURA MASABUMI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH01258499A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1989</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>NAKAMURA MASABUMI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NAKAMURA MASABUMI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CHIPLIKE ELECTRONIC COMPONENT FEEDING METHOD</title><date>1989-10-16</date><risdate>1989</risdate><abstract>PURPOSE:To enable a chiplike electronic component to be sucked in such a state that the component is held making its side face of the maximum area upright by a method wherein one side of the chip-like component is pushed up by a component push-up pin which protrudes into a pocket and a vacuum suction device is made to approach as the component is kept in this state. CONSTITUTION:When a component push-up pin 27 is made to ascend, the pin 27 protrudes into a pocket 11 breaking through a cover film 14 and lifts the front of a chiplike electronic component 1. When the pin 27 is made to ascend further, the side face maximum in area of the component 1 is made to stand upright gradually. A component suction device 26 is made to descend when the component 1 stands completely upright, and the component 1 is sucked by the device 25 in a preintended position. The device 25 is made to ascend and transfer the component 1, and the push-up pin 27 is made to descend and pulled out from the film 14. By these processes, the component 1 is sucked with its side face maximum in area upright.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_JPH01258499A
source esp@cenet
subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title CHIPLIKE ELECTRONIC COMPONENT FEEDING METHOD
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-04T22%3A36%3A19IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=NAKAMURA%20MASABUMI&rft.date=1989-10-16&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPH01258499A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true