CHIPLIKE ELECTRONIC COMPONENT FEEDING METHOD

PURPOSE:To enable a chiplike electronic component to be sucked in such a state that the component is held making its side face of the maximum area upright by a method wherein one side of the chip-like component is pushed up by a component push-up pin which protrudes into a pocket and a vacuum suction device is made to approach as the component is kept in this state. CONSTITUTION:When a component push-up pin 27 is made to ascend, the pin 27 protrudes into a pocket 11 breaking through a cover film 14 and lifts the front of a chiplike electronic component 1. When the pin 27 is made to ascend further, the side face maximum in area of the component 1 is made to stand upright gradually. A component suction device 26 is made to descend when the component 1 stands completely upright, and the component 1 is sucked by the device 25 in a preintended position. The device 25 is made to ascend and transfer the component 1, and the push-up pin 27 is made to descend and pulled out from the film 14. By these processes, the component 1 is sucked with its side face maximum in area upright.