METALIZING CONNECTION METHOD

PURPOSE:To make the metalization easier and to obtain an even and solid metalizing strength by forming an alloy of a specific mixing ratio of Ti, Co, and Ag, then smashing it to make a fine powder, and using the fine powder for the metalization. CONSTITUTION:An alloy which consists of Ti 15 to 25%,...

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1. Verfasser: SASHIKI MASARU
Format: Patent
Sprache:eng
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Zusammenfassung:PURPOSE:To make the metalization easier and to obtain an even and solid metalizing strength by forming an alloy of a specific mixing ratio of Ti, Co, and Ag, then smashing it to make a fine powder, and using the fine powder for the metalization. CONSTITUTION:An alloy which consists of Ti 15 to 25%, Cu 60 to 40%, and Ag 25 to 35%, in the weight ratio, is powdered minutely, and a binder is added to the resultant alloy powder for metalization to make a paste. Then, the paste is spread at the connection parts of the metal flange 2 of a ceramics tube 1. After that, by heating it in a vacuum or in an inert gas, Ti in the alloy powder for metalization is diffused in the ceramics to form a solid metalizing layer 3. In this case, Cu and Ag in the alloy powder for metalization reduce the metalizing temperature, while Ag improves the wetting performance, and a metalyzing layer of an even and dense formation in all parts is formed. Then, after a metal coating is applied to the layer 3, the flange 2 is geared closely to it, and the ceramics tube 1 and the flange 2 are connected through a silver solder at the gearing part.