FORMATION OF MASKING LAYER

PURPOSE:To enable a masking layer the specified whole part of which is covered to be printed by a method wherein, when a specified part is to be formed by stamping a hole or a configuration, the part to be stamped out is pushed back and then a masking layer is printed on a specified part. CONSTITUTI...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: TAKEMURA HIROYASU, MIZUTA KEN, FUJIOKA KAZUNORI
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PURPOSE:To enable a masking layer the specified whole part of which is covered to be printed by a method wherein, when a specified part is to be formed by stamping a hole or a configuration, the part to be stamped out is pushed back and then a masking layer is printed on a specified part. CONSTITUTION:A hole 4 is perforated into a printed substrate 1 formed of conductive parts 6 in specified positions by a stamping member 9. Later, the stamped out substrate 1' is restored i.e., so called pushed back to its original position when the stamping member 9 is being reset. The hole 4 is stopped up again by the stamped out substrate 1'. A masking layer covering the conductive parts 6 is formed on the specified whole part including the surface of the pushed back substrate 1'. Thus, the masking layer can be printed in a single pattern covering the specified part by the existance of the pushed back substrate part 1'. Through these procedures, even if there is any stamped part such as a hole etc., on the printed substrate whereon the masking layer must be formed, a masking material including such a part can be formed easily by printing process.