CERAMIC PACKAGE TYPE SEMICONDUCTOR DEVICE

PURPOSE:To obtain a ceramic package type semiconductor device having no defective flow and defective sink mark and having high airtightness by forming a through-hole shaped to at least one of a ceramic substrate and a ceramic cap and a cover member mounted while closing the through hole after the ceramic cap is sealed. CONSTITUTION:An internal chamber 23 is shaped between a semiconductor element 11 fixed to a ceramic substrate 12 and a ceramic cap 19 and a gas in the internal chamber 23 expands on heat treatment, but the expanding gas is diffused to the outside through a through-hole 14 formed to another surface of the ceramic substrate 12 and a third recessed section 13c. Consequently, internal pressure in the internal chamber 23 is kept in the same extent as external pressure on heat treatment. Accordingly, a solidified glass sealing medium 18 has no defective sink mark after the completion of heat treatment. The through-hole 14 functioning as a vent hole is closed by fitting and sealing a cover member 21 having a 1mm diameter and 0.5mm thickness and being made of ceramics into the third recessed section 13c; thus, complete hermetic seal is conducted.