MULTILAYER PRINTED WIRING BOARD AND CONNECTOR THEREFOR

PURPOSE:To provide a multilayer wiring board capable of preventing unrequired radiation and having an exposed surface area being reduced, by composing the wiring board of a first face having a power supply layer, a second face having a component attaching and grounding layer, a plurality of signal l...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SUWA KATSUHIKO, ANDOU TAKUJI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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