MULTILAYER PRINTED WIRING BOARD AND CONNECTOR THEREFOR
PURPOSE:To provide a multilayer wiring board capable of preventing unrequired radiation and having an exposed surface area being reduced, by composing the wiring board of a first face having a power supply layer, a second face having a component attaching and grounding layer, a plurality of signal l...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | PURPOSE:To provide a multilayer wiring board capable of preventing unrequired radiation and having an exposed surface area being reduced, by composing the wiring board of a first face having a power supply layer, a second face having a component attaching and grounding layer, a plurality of signal layers provided within the board between the first and second faces and a signal input/output section. CONSTITUTION:A multilayer wiring board 10 comprises a first face 12 having a power supply layer; a second face 14 having a component attaching and grounding layer 13 to which a surface packaging component 17 is to be attached; a plurality of signal layers 15 provided within the board between the first and second faces 12 and 14: a signal input/output section 16 for inputting or outputting a signal from the signal layers 15. On the other hand, a multilayer wiring board connector comprises a connection pin 21 to be in contact with the signal layers of the signal input/output section 16 projected from the wiring board 10; an insulator 22 for fixing the connection pin 21; and a shield metal case 23 to be in contact with the first face 12 having the power supply layer 11 and with the second face 14 having the component attaching and grounding layer 13. |
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