PHOTORESIST COMPOSITION

PURPOSE:To obtain a photoresist compsn. having high chemical resistance and superior gold plating characteristics by combining a specified carboxyl group-contg. polymer with a specified urethane type polymerizable compd. CONSTITUTION:The title photoresist compsn. consists of 5-93wt.% linear copolymer having 100-600 carboxyl group equivalent and 10,000-500,000 weight average mol.wt. consisting of a styrenic monomer selected from compds. expressed by formula I, a carboxylic group-contg. monomer selected from alpha,beta- unsatd. carboxylic acids, and a vinyl compd. selected from vinyl compds. contg. no carboxyl group, 5-93wt.% photopolymerizable unsatd. compd. contg. at least 30wt.% unsatd. urethane compd. selected from compds. expressed by formula II, and 0.01-30wt.% photopolymn. initiator. In formulas, R is H atom, etc.; X is halogen atom, etc.; (n) is zero or 1-3; each R -R is H atom, etc.; A is a hydrocarbon residue; (m) is 2-25; (n) is an integer 1-25. Thus, a photoresist compsn. having high chemical resistance permitting sufficient gold plating is obtd.