RESIN SEAL TYPE SEMICONDUCTOR DEVICE

PURPOSE:To prevent cracks generated in the lower section of a bonding pad section in a pallet, to avoid defective input/output leakage and to improve reliability by controlling thickness of the bonding pad section in the pallet of a wire for a connector from the pellet of the bonding pad section and joining the wire. CONSTITUTION:When wires 5 for a connector are composed of Au wires and bonding pad sections 6 in a pellet 4 consist of Al pads, Au balls 5' in the wires 5 for the connector form Au-Al alloys 10 among the Au balls 5' and the Al pads 6 on the pellet 4, and bonded. The width S of the Au-Al alloys 10 is used as bonding width and t/S is brought to 0.2 or less in thickness (t) from the pellet 4 in bonding sections in the wires 5 for the connector made up of the Au balls 5'. The ratio of t/S is brought to 0.2 or less only at the corner sections of the pellet 4, not the whole bonding pad section 6 of the pellet 4.