MANUFACTURE OF FILM CONDENSER

PURPOSE:To restrain the decline in the withstand voltage characteristics in the film condenser formation process by a method wherein the edge part side slitted by the slope side of a slit single edge is positioned only on the condenser margin part and then the edge part overlapped with a dielectric...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KUSUNO SHOICHI, KINOSHITA NAGAO, YAMADA KENJI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PURPOSE:To restrain the decline in the withstand voltage characteristics in the film condenser formation process by a method wherein the edge part side slitted by the slope side of a slit single edge is positioned only on the condenser margin part and then the edge part overlapped with a dielectric film is wound around to be flattened. CONSTITUTION:An edge part 2 slitted by the slit single edge slope side of a strip of metallic foil 1 which is manufactured by band type-slitting the metallic foil 1 in specified width using the slit single edge is positioned only on the B side of a condenser margin part and then the edge part 2 overlapped with a dielectric film is wound around further to be flattened. Consequently, when the metallic foil 1 as an electrode is wound around together with the dielectric film, the edge part side with higher burr is positioned on the electrode leading out protrusion while the edge part side with lower burr is positioned on the condenser margin part so that the stress imposed by the burr on the film in the flattening process may be relieved. Through these procedures, the decline in the withstand voltage level can be reduced.