LEAD FRAME

PURPOSE:To inhibit the deformation of an inner lead, and to improve the yield of bonding by forming structure in which the nose of an inner lead section is housed into a recessed section shaped around an island at a specified clearance. CONSTITUTION:In a lead frame having an island 1 as a semiconductor-chip loading section, inner lead sections 2 conducting electrical connection with a semiconductor chip and outer lead sections performing electrical connection with the outside of a resin seal section after the inner lead sections 2, structure in which the noses of said inner lead sections 2 are housed into recessed sections 4 shaped around the island 1 at specified clearances is formed. The shapes of the island 1 and the inner leads 2 are formed through stamping and etching from a blank, and the nose sections of the inner, leads 2 are pushed as a coin and coining sections 3 are formed. Accordingly, the nose sections of the inner leads 2 are extended in the width directions of the nose sections and the direction of the island, and housed into the recessed sections 4 in the island 1.