DICING METHOD FOR WAFER

PURPOSE:To eliminate the displacement of dicing by measuring the number of dicing lines in a predetermined range and a distance between both ends, calculating the pitches of X-axis and Y-axis, and dicing a wafer on the basis of the value. CONSTITUTION:When a wafer 1 is positioned on a table 16, the dicing 6 of an x-axis is recognized by an optical recognition system 4, a distance from x3 to x2 and the number (m) of the dicing lines 6 therebetween are measured, the table 16 is then turned at 90 deg., and a distance from y3 to Y2 and the number (n) of the dicing lines 6 therebetween are measured. Then, the dicing pitch Px of x-axis is calculated by Px=(x3-x2)/(m-1), and the dicing pitch Py of y-axis is calculated similarly by Py=(y3-y2)/(n-1). Motors 15, 17 are pitch-fed corresponding to the values of the pitches Px, Py through motor driving means 18. Accordingly, an error due to the working conditions, such as thermal factor, etc., can be prevented, thereby improving the dicing accuracy of the wafer.