WAFER REPLACING METHOD

PURPOSE:To reduce the contamination with foreign matters in a thermostatic chamber by a method wherein a wafer cassette is placed on a cassette stand on the load side and the unload side, and the cassette stand is picked up to outside the thermostatic chamber automatically. CONSTITUTION:An aperture...

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Bibliographische Detailangaben
1. Verfasser:	KURIMOTO KOZO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PURPOSE:To reduce the contamination with foreign matters in a thermostatic chamber by a method wherein a wafer cassette is placed on a cassette stand on the load side and the unload side, and the cassette stand is picked up to outside the thermostatic chamber automatically. CONSTITUTION:An aperture 20 in the size in which a loading cassette 8 and an unloading cassette 10 can be taken in or out is provided at a part of the wall surface of a thermostatic chamber 11. When a wafer cassette is replaced, first, a cover 21 is rotated downward. An electromagnetic valve 23 is functioned by operating a switch, and a rod 25 is shifted by allowing compressed air to flow into an air cylinder 24. A wafer stand 26, on which a wafer cassette is placed, is connected to the tip of the rod 25. The wafer cassette is passed through the aperture part 20 of the wafer chamber 11, and picked up to outside of the chamber 11. As a result, the contamination in the chamber 11 with foreign matters can be reduced.