SOLDERING APPARATUS

PURPOSE:To improve reliability of soldering and productivity, by providing a heating head so that it can be rotated, and providing a positioning mechanism, which determines the position of the heating head at an arbitrary point. CONSTITUTION:A heating head 3 has four heating chips 8, which correspond to lead-leg lines at the force sides of a flat package type IC 7, at the tip part. The heating head 3 is supported with a supporting member 2 so that the head 3 can be rotated. A positioning mechanism 10, which positions the heating head 3 at an arbitrary rotating position, is provided. Therefore, the angular position of the flat package type IC 7 can be set arbitrarily by the rotation of the heating head 3. Replacement of the heating head 3 is not required. In this way, parallelism between the lower surface of the heating chip of the heating head 3 and the upper surface of a wiring board is kept at the initially set state at the time of assembling, and high reliability in soldering is obtained. Productivity is also improved.