MOUNTING OF SEMICONDUCTOR ELEMENT

PURPOSE:To assure the electric contact simultaneously preventing a semiconductor element from damaging by a method wherein the electrode surfaces and non-electrode surfaces are coated with insular conductive pastes almost flush with one another. CONSTITUTION:Electrodes 12 and non-electrode surfaces of a semiconductor element 11 are insularly screen-printed with conductive pastes 19 while the semiconductor element 11 with the conductive pastes 19 aligned with the specified positions on a wiring circuit substrate 13 is pressurized to cure the conductive pastes 19. In other words, the electrodes surfaces and the non-electrode surfaces of the semiconductor element 11 are coated with the insular conductive pastes 19 almost flush with one another so that the pushing pressure in case of pressurizing the semiconductor element 11 on the wiring circuit substrate 13 to be brought into contact with each other may be given evenly to overall element. Through these procedures, the electric contact can be assured while eliminating the local pressurization on the semiconductor element 11 thereby preventing the element 11 from damaging.