RESIN-SEALED SEMICONDUCTOR DEVICE

PURPOSE:To prevent a semiconductor element from cracking or its characteristic from varying, and to improve reliability by employing a film of semicured state mixed with a filler having small linear expansion coefficient with thermosetting resin as an insulating adhesive material. CONSTITUTION:A semiconductor element 1 is secured on inner leads 2 with an insulating adhesive material 3. As the material 3, a film of semicured state mixed with a filler having small linear expansion coefficient with thermosetting resin, or glass cloth, aramid cloth, quartz cloth, etc., is impregnated with thermosetting resin, and prepreg of semicured state is employed. It is interposed between the element 1 and the leads 2, and thermally cured. Thus, a thermal stress is reduced, temperature cycling resistance, moisture resistance, etc., are excellent, and reliability is improved.