NOVEL EPOXY COMPOUND

NEW MATERIAL:An epoxy compound expressed by formula I, i.e., tetraglycidyl ether of 1,1',2,2'-tetrakis(3,5-dimethyl-4-hydroxyphenyl)ethane. USE:Useful as a blend of an epoxy resin composition having excellent resistance to heat, impact and water, capable of providing cured products, having...

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Bibliographische Detailangaben
Hauptverfasser: MARUYAMA TOSHIKAZU, TAKUWA NARITSUYO, ARITOMI MICHIO
Format: Patent
Sprache:eng
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Zusammenfassung:NEW MATERIAL:An epoxy compound expressed by formula I, i.e., tetraglycidyl ether of 1,1',2,2'-tetrakis(3,5-dimethyl-4-hydroxyphenyl)ethane. USE:Useful as a blend of an epoxy resin composition having excellent resistance to heat, impact and water, capable of providing cured products, having high heat resistance and excellent impact and water resistance in using alone or as a mixture with other epoxy compounds and utilizable in a wide range, such as sealing agents for electronic parts, circuit boards, adhesives, coating materials, etc. PREPARATION:1,1',2,2'-Tetrakis(3,5-dimethyl-4-hydroxyphenyl)ethane expressed by formula II is reacted with an epihalohydrin in the presence of a catalyst to afford the aimed compound expressed by formula I. The amount of the epihalohydrin used is preferably 8-25mol based on 1mol phenolic hydroxyl groups in the compound expressed by formula II.