THERMOSETTING SILVER PASTE COMPOSITION WITH EXCELLENT HEAT RESISTANCE

PURPOSE:To improve heat resistance, adhesion strength, conductivity, soldering wettability, etc., by making a thermosetting binder of single-liquid thermosetting silver paste composed of blocked isocyanate which blocked epoxy resin, novolak resin, and isocyanate compound. CONSTITUTION:A single-liqui...

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Bibliographische Detailangaben
Hauptverfasser:	ECHIGO SUSUMU, IWASAKI TOSHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONDUCTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PURPOSE:To improve heat resistance, adhesion strength, conductivity, soldering wettability, etc., by making a thermosetting binder of single-liquid thermosetting silver paste composed of blocked isocyanate which blocked epoxy resin, novolak resin, and isocyanate compound. CONSTITUTION:A single-liquid thermosetting silver paste composition has silver powder and a thermosetting binder as the indispensable components, and the silver powder is the usually used one and the epoxy resin is of bisphenol A and F types, or novolak type, or the like. Next, imidazole-group blocked isocyanate is made by blocking adduct material or the like of alkylene diisocyanate or isocyanate group such as tolylendiisocyanate, diphenylmethane diisocyanate, or the like to polyvalent alcohol with imidazole group such as imidazole, 2-methyl imidazole, or the like. Thereby, the isocyanate which isolates at hardening reacts with the epoxy resin, so the resin with excellent heat resistance and adhesion can be formed.