METHOD AND APPARATUS FOR ELECTROLESS PLATING

PURPOSE:To inhibit the decomposition reaction of supplementary components and to prevent the formation of projections on a material to be plated by supplying a concentrated solution for supply in drops or in a sprayed state from the position higher than a plating bath level according to the progress...

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Bibliographische Detailangaben
Hauptverfasser:	NAKASO AKISHI, OGINO HARUO, WATANABE TOMOKO, OKAMURA TOSHIRO, TOYOSHIMA TAKEHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PURPOSE:To inhibit the decomposition reaction of supplementary components and to prevent the formation of projections on a material to be plated by supplying a concentrated solution for supply in drops or in a sprayed state from the position higher than a plating bath level according to the progress of electroless plating. CONSTITUTION:A pipe 3 having a supplementary feed nozzle 1 is provided to the position higher than the prescribed liquid level of a plating bath 6 in a plating tank 2. In the above electroless plating apparatus, electroless plating is carried out while supplying the components consumed with the progress of plating reaction by using a solution having a concentration higher than the prescribed concentration in the plating tank 2. At this time, the concentrated solution for supply containing supplementary components 5 is supplied in drops or in a sprayed state via the above supplementary feed nozzle 1 from the position higher than the liquid level of the plating bath 6. By this method, the dissolution, diffusion, and mixing of the supplementary components 5 are uniformized and, as a result, decomposition reaction in the locally high- concentration part can be reduced.