SEALING RESIN COMPOSITION AND PRODUCTION THEREOF

PURPOSE:To obtain the title composition, consisting essentially of a resin containing a polyamide based resin homogeneously blended in a novolak type phenolic resin, epoxy resin and inorganic filler, having excellent moisture resistance without dispersion of low stress characteristics and useful as...

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Bibliographische Detailangaben
1. Verfasser:	SAWAI KAZUHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain the title composition, consisting essentially of a resin containing a polyamide based resin homogeneously blended in a novolak type phenolic resin, epoxy resin and inorganic filler, having excellent moisture resistance without dispersion of low stress characteristics and useful as electronic.electrical parts, etc. CONSTITUTION:The aimed composition obtained by melting (A) a novolak type phenolic resin, adding (B) preferably 0.1-90wt.% polyamide based resin into the melt, homogeneously dispersing and blending both, pulverizing the resultant resins (A+B) and (C) an epoxy resin, adding (D) preferably 25-90wt.% inorganic filler and, as necessary, other components and further kneading the obtained blend while heating, cooling, solidifying and pulverizing the kneaded blend. Furthermore, the content of the resins (A+B) is preferably 1-30wt.% and the molar ratio (gamma/alpha) of the epoxy groups (gamma) in the component (C) to the phenolic OH groups (alpha) in the component (A) is preferably 0.1-10.