COOLER FOR ASSEMBLY OF LSI CHIPS

PURPOSE:To reduce the weight, size of a cooler for an assembly of LSI chips and to eliminate the necessity of specially considering cooling water by bringing the heat absorbing surface of a thermionic element into contact with the assembly of the chips placed on a circuit substrate, and cooling the heat generating surface of the element by cooling means. CONSTITUTION:A copper electrode 104a for connecting thermionic elements 103a, 103b which form a Peltier module is brought into contact with the upper substrate of a ceramic LSI assembly 101 placed on a circuit substrate 102. Water-cooled plate 105 in which cooling water flows therein is brought into contact with a copper electrode 104b at the opposite side face of the assembly 101 of the elements 103a, 103b. When currents flows to the elements 103a, 103b, the heat generated from the assembly 101 is cooled by the elements 103a, 103b, and the heat generated from the opposite surface of the assembly 101 is cooled by the plate 105. Thus, the cooler can be reduced in weight and size, and there is no necessity of specially considering the cooling water.