LEAD FRAME AND MANUFACTURE THEREOF

PURPOSE:To reduce the assembling cost of a semiconductor device by plating with easily adhesive copper on at least wire bonded part of a lead frame, solder- plating an external lead section, and obtaining the lead frame with a practical solder-plating film. CONSTITUTION:At least wire bonded part of...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	KATO YOSHIHISA, FUKUDA MANJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PURPOSE:To reduce the assembling cost of a semiconductor device by plating with easily adhesive copper on at least wire bonded part of a lead frame, solder- plating an external lead section, and obtaining the lead frame with a practical solder-plating film. CONSTITUTION:At least wire bonded part of a lead frame is plated with easily adhesive copper. At least outer lead section is solder-plated. The easily adhesive copper plating means copper plating which can wire bond. The material of the frame may include iron alloys, iron-nickel alloys, or copper alloys, etc. Thus, the lead frame with a practical solder-plating film is obtained, and the assembling cost of a semiconductor device is reduced.