DEVICE FOR CONNECTING INTER-SUBSTRATE SIGNAL

PURPOSE:To obtain the thermal fatigue life of a connecting pin and to reduce a noise generated at the pin by providing a conductor coaxially surrounding the pin and insulated from the pin, and electrically connecting ground terminals exposed on a signal circuit substrate and a power supply substrate...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: FUJITA YUJI, NAKANISHI KEIICHIRO, YAMADA MINORU
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PURPOSE:To obtain the thermal fatigue life of a connecting pin and to reduce a noise generated at the pin by providing a conductor coaxially surrounding the pin and insulated from the pin, and electrically connecting ground terminals exposed on a signal circuit substrate and a power supply substrate to the conductor. CONSTITUTION:A power source through hole 5a and a ground through hole 5b are formed in a signal circuit substrate 101, and respectively connected to a power terminal 6a and a ground terminal 6b on a substrate. Then, a connecting pin for integrating a columnar pin 7 having a cylindrical washer, a conductor 8 coaxially surrounding the pin 7 and an insulator 9 for holding insulation therebetween is connected by a bonding material to the lower part of the substrate. In this case, the terminal 6a is connected to the pin 7, and the terminal 6b is connected to the conductor 8. On the other hand, a through hole 10 is formed at a power supply substrate 102, the connecting pin is inserted, and a power supply layer 4a is electrically connected to the pin 7 by a low melting point solder.