WAFER PROBER

PURPOSE:To automate probe needle tip positioning by allowing both an image sensing system for needle detection and an image sensing system for bonding pad detection to be position-adjusted at any point in relation to an identical reference point. CONSTITUTION:A wafer is held on a wafer chuck 1 which is caused to travel by an XY stage 3, a group of probe needles are caused to be in contact with a group of bonding pads on a chip sequentially for every chip. The position of the bonding pad is measured with am image sensing device 5 having a capacitance type sensor 4 to measure the wafer height while the position of the needle tip is measured with a TV camera 20, the results of which are processed by an image processing circuit and a probe sequence controller, and an automatic positioning operation is performed by driving a pulse motor.