REMOVING DEVICE

PURPOSE:To improve the throughput of a step of removing organic matter, such as a photoresist by oppositely disposing a heat source and a processing gas inlet port at both side faces of a wafer supported by supporting means provided in a processing chamber. CONSTITUTION:The peripheral edge of a wafer 4 is interposed and held from above and below at the ends of a pair of supporting rods 3, 3 provided at the top and the bottom of a processing chamber 2 so that the front and rear faces of the wafer 4 formed with predetermined circuits are directed to the right and left walls of the chamber 2. Processing gases are supplied from a pair of processing gas inlet ports 5, 5 disposed horizontally at the center of the right and left walls of the chamber 2 against both surfaces of the wafer 4, while the wafer 4 and its vicinity are heated to a predetermined temperature by a plurality of infrared ray lamps 7 disposed at a predetermined interval on the walls of the ends of the inlet ports 5, 5, thereby simultaneously processing both surfaces of the wafer 4. Thus, the throughput of a step of removing the organic matter, such as photoresist can be improved.