METHOD FOR BONDING SUPERCONDUCTIVE MATERIALS

PURPOSE:To easily bond superconductive materials without causing a change in the critical temp. and limiting current in the bonded surfaces by pressing the formed or sintered bodies of a superconductive material on each other bonding surface, and heating the bodies. CONSTITUTION:The formed or sinter...

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Bibliographische Detailangaben
Hauptverfasser:	KAWARABATA JIRO, MUTO MUTSUHARU, TOKIDA MAKOTO, AIZAWA TAKESHI, NODA TOSHIAKI
Format:	Patent
Sprache:	eng
Schlagworte:	ARTIFICIAL STONE CEMENTS CERAMICS CHEMISTRY COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSESC01D OR C01F CONCRETE INORGANIC CHEMISTRY LIME, MAGNESIA METALLURGY REFRACTORIES SLAG TREATMENT OF NATURAL STONE
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Beschreibung
Zusammenfassung:	PURPOSE:To easily bond superconductive materials without causing a change in the critical temp. and limiting current in the bonded surfaces by pressing the formed or sintered bodies of a superconductive material on each other bonding surface, and heating the bodies. CONSTITUTION:The formed or sintered bodies of a superconductive material (e.g., YBa2Cu3O7-x) are pressed on each bonding surface with the pressure of at least 0.1kg/mm , and heated to about 900-970 deg.C to bond the superconductive materials. When the powder of the same superconductive material constituting the formed or sintered body is placed on the bonding surface, the bonding can be more efficiently carried out. When a copper compd. is used as the superconductive material, the power or paste of cupric oxide is placed on the bonding surface, and an excellent bonding result can be obtained.