MOUNTING OF ELECTRONIC COMPONENT BY REFLOW SOLDERING

PURPOSE:To mount a flat-type electronic component having a formed lead terminal on a printed-circuit board by using a sufficient solder amount and to eliminate a defect due to a bridge phenomenon by a method wherein the rear surface at least up to a front end and atmost up to a root of a connection...

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Bibliographische Detailangaben
1. Verfasser:	NAKAOKA YASUYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
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Beschreibung
Zusammenfassung:	PURPOSE:To mount a flat-type electronic component having a formed lead terminal on a printed-circuit board by using a sufficient solder amount and to eliminate a defect due to a bridge phenomenon by a method wherein the rear surface at least up to a front end and atmost up to a root of a connection part of the lead terminal is made a surface state which is relatively easily wetted by a solder as compared with a remaining part of the lead terminal. CONSTITUTION:A creamy solder is printed on a land part 2 of a board 1 by using a metal mask or a screen mask; a lead terminal of an electronic component is pressed to the solder; the component is mounted temporarily by means of an adhesive force of the creamy solder; after that, the solder is melted by a heating process by means of infrared rays, steam or the like; after that, when the solder is solidified, a solder is plated 12 on the rear surface at a tip part of a connection part 6; this plated part is wetted more easily than other parts with reference to a molten solder. Accordingly, when a meniscus is completed in a part which suddenly rises from a root of the connection part 6, the molten solder hardly flows. As a result, a stream S toward the root of the connection part 6 from a tip part of the land part 2 is suppressed; a bridge phenomenon P is reduced.