JP2982951B

PURPOSE: To improve a signal transmission rate due to the floating capacitance between a semiconductor chip and a lead and to reduce electrical noise by partially forming an insulator along a part where a circuit formation surface faces an inner lead part. CONSTITUTION: An insulation film 4A is provided in advance at the total or one portion of a face which mostly closely contacts the semiconductor chip of a surface opposing the main surface of a semiconductor chip 1 of an inner lead 3A1 for signal and a shared inner lead 3A2 , for example, in the state of a lead frame 3 and the insulation film 4A and the semiconductor chip 1 are adhered and fixed by an adhesive on assembly, thus reducing the area of the film 4A. Also, the inner lead 3A1 for signal/shared inner lead 3A2 and the film 4A can be properly aligned.