JP2981951B

JP2981951B

PURPOSE:To obtain a wire bonding device which feeds stable vibration energy and is changeable in frequency and vibration amplitude while it carries out a bonding operation by a method wherein a piezoelectric element, a microcomputer, and a control circuit all specified respectively are provided. CON...

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Hauptverfasser: OOKI TOYOKAZU, TAKAHASHI KUNYUKI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator OOKI TOYOKAZU
TAKAHASHI KUNYUKI
description PURPOSE:To obtain a wire bonding device which feeds stable vibration energy and is changeable in frequency and vibration amplitude while it carries out a bonding operation by a method wherein a piezoelectric element, a microcomputer, and a control circuit all specified respectively are provided. CONSTITUTION:A capillary 5 where a wire 4 is inserted is fixed to one end of a bonding arm 2, and the bonding arm 2 is built in a wire bonding device in a vertically movable and a swingable manner. An piezoelectric element 7 which transmits vibrations to the capillary 5 built in the bonding arm 2 through a magnetostrictive or an electrostrictive effect and a microcomputer 40 which outputs frequency data and amplitude data that determine the amplitude of vibrations are provided to the wire bonding device. A control circuit which applies an output voltage or current onto the piezoelectric element 7 determining its waveform and amplitude basing on the frequency data and the amplitude data outputted from the microcomputer 40 is provided. For instance, the control circuit is composed of a memory element 44, a programmable frequency generator 42, and D/A converters 45 and 46.
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CONSTITUTION:A capillary 5 where a wire 4 is inserted is fixed to one end of a bonding arm 2, and the bonding arm 2 is built in a wire bonding device in a vertically movable and a swingable manner. An piezoelectric element 7 which transmits vibrations to the capillary 5 built in the bonding arm 2 through a magnetostrictive or an electrostrictive effect and a microcomputer 40 which outputs frequency data and amplitude data that determine the amplitude of vibrations are provided to the wire bonding device. A control circuit which applies an output voltage or current onto the piezoelectric element 7 determining its waveform and amplitude basing on the frequency data and the amplitude data outputted from the microcomputer 40 is provided. 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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title JP2981951B
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