JP2981951B

PURPOSE:To obtain a wire bonding device which feeds stable vibration energy and is changeable in frequency and vibration amplitude while it carries out a bonding operation by a method wherein a piezoelectric element, a microcomputer, and a control circuit all specified respectively are provided. CONSTITUTION:A capillary 5 where a wire 4 is inserted is fixed to one end of a bonding arm 2, and the bonding arm 2 is built in a wire bonding device in a vertically movable and a swingable manner. An piezoelectric element 7 which transmits vibrations to the capillary 5 built in the bonding arm 2 through a magnetostrictive or an electrostrictive effect and a microcomputer 40 which outputs frequency data and amplitude data that determine the amplitude of vibrations are provided to the wire bonding device. A control circuit which applies an output voltage or current onto the piezoelectric element 7 determining its waveform and amplitude basing on the frequency data and the amplitude data outputted from the microcomputer 40 is provided. For instance, the control circuit is composed of a memory element 44, a programmable frequency generator 42, and D/A converters 45 and 46.